Description
The magnetron sputterer is used to deposit a large range of metals and dielectrics. The particles that impinge on the substrate surface have a higher energy (1 eV) than that obtained by evaporation (0.1 eV), which confers to the films a higher density and a better adhesion. Reactive sputtering is also available with this system, to deposit oxides or nitrides. A hopper provides quick charging of the samples in the deposition chamber.
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Uses
- Thin film deposition of metals and dielectrics
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Technical specifications
| Substrates : |
Semiconductors, metals, plastics |
| Sample holder : |
4 in diameter |
| Base pressure : |
5x10-7 torr |
| Pumping time : |
10 min |
| Target sample holder distance : |
5 in |
| Gases available : |
Ar, N2, O2 |
| Number of magnetrons : |
3 |
| Thickness precision : |
5% |
| Deposition rate : |
1 - 10 Angströms / s |
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| Manufacturer : |
Homemade |
| Model : |
Homemade |
