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Groupe de recherche en physique et technologie des couches minces (GCM)

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Materials analysis

The GCM provides leading edge analytical services in three main domains : chemical analysis, microscopy and mechanical tests.

Chemical analyses

  • Time of Flight Secondary Ion Mass Spectroscopy (TOF-SIMS)
  • X-ray Photoelectron Spectroscopy (XPS)
  • Fourier Transform Infrared Spectroscopy (FTIR)
  • Raman Microspectroscopy
  • Auger Electron Spectroscopy (AES)
  • Rutherford Backscattering (RBS)
  • Elastic Recoil Detection (ERD)

Microscopy

  • Atomic Force Microscopy (AFM)
  • Dual beam Focused Ion Beam / Scanning Electron Microscopy
  • Scanning Electron Microscopy (SEM)
  • Optical Microscopes


Mechanical testing

  • Profilometry
  • Microhardness
  • Microscratch testing
  • Nano-indentation
  • Tribometry
  • Slip-peel tester
  • Stress measurement

Other techniques

  • Ellipsometry
  • Absorption spectroscopy
  • Spectrophotometry
  • Surface plasmon resonance refractometry
  • Photoluminescence (PL) and excitation photoluminescence
  • Contact angle measurements
  • Nuclear Reaction Analysis (NRA)
  • Ion channelling
  • Medium Energy Ion Scattering (MEIS)
  • Brewster Angle Microscopy / Ellipsometric imaging
  • Electron Beam Scattering Diffraction (EBSD-UHV)
  • Four point probe
 

Services to companies

Materials analysis
TOF-SIMS
X-ray Photoelectron Spectroscopy (XPS)
Fourier Transform Infrared Spectroscopy (FTIR)
Raman microspectroscopy
Auger Electron Spectroscopy (AES)
Rutherford Backscattering (RBS)
Elastic Recoil Detection (ERD)
Atomic Force Microscopy (AFM)
Dual-beam FIB/SEM
Scanning Electron Microscope (SEM)
Profilometry
Microhardness testing
Microscratch Testing
Nano-indentation
Tribometry
Slip-peel tester
Stress measurement
Ellipsometry
Absorption spectroscopy
Spectrophotometry
Surface Plasmon resonance refractometry
Photoluminescence
Contact angle measurements
Nuclear Reaction Analysis (NRA)
Ion Channelling Measurement
Medium Energy Ion Spectroscopy (MEIS)
Brewster Angle Microscopy / Ellipsometric Imaging
Electron Backscatter Diffraction (UHV-EBSD)
Four points probe
Overview
Contact for industrial customers
Our achievements
Our customers
Thin film deposition
Solutions by application
Solutions by industrial sector
Publications

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