Dicing saw
The saw allows the dicing of large wafers into individual chips. The precision of the tool maximize device yield.
manufacturer: Advanced Dicing Technology
Model: ADT 7100 Provectus
minimal sample size: few mm parts
maximal sample size: 8 inches wafers
Maximal trench depth: 2,1 mm (realised)
Cutting speed: 0 to 600 mm/s
Spindle speed: 60 KRPM max, 1,2 KW
Blades: resin bond , hubbed nickel bond…etc
Blades diameter: 2 or 3 inches
Trench depth precision: 0.2 microns resolution with 2 micron precision.
Materials : Si, Glass, Pyrex, LiNBO3, SiO2, Ceramic, Si on Glass, Quartz, Aluminium, Ferrite…
