Lithography is a central microfabrication step. Using photosensitive resist material, master patterns are transfered on the substrate surface. Many lithography and alignment steps over different material layers may be necessary to complete a device.
- Surface pretreatment oven
- Photoresist coating
- MA6 Mask Aligner
- MA4 Mask Aligner
- Available photoresists
The YES oven has several programmed recipies available, for vacuum or nitrogen environment dehydration and vapor deposition of HMDS precursor.
Manufacturer: Yield Engineering Systems
Number of programs available: 12
Silanisation material: HMDS
The photolithography room offers 2 spincoating stations.
Small part up to 200 mm wafers may be resist coated using this spincoater. The system include automatic dispense of edge bead removal and photoresist. All staedy state, acceleration and spinnning speeds are programmable.
The attached hotplate allows for high uniformity resist baking.
Manufacturer: Brewer Sciencce
The Laurell spincoater is a versatile tool for material and photoresist coating.
The spinner can accomodate very small samples (mm2) up to 150mm wafers. Acceleration and spinning speeds are programmable.
A EFD fluid dispenser and a programmable hotplate complete the work station.
MA-6 Mask Aligner
The MA6 is a contact mask aligner well adapted to the challenging and variable laboratory use, allying precision and flexibility. The aligner has double microscope field view and a backside CCD camera to allow fast and precise aligment for single and double side needs. It also allows the use of very small samples up to 6 inches full wafers.
Manufacturer : Karl Suss
Model : MA-6/BA-6
- Mask dimensions: ≤ 7″
- Sample size: 1cm2 to 6 in
- Contact modes: 5 available (hard vacuum to proximity)
- Lamp: 350W Hg
- Optics: UV 400 (436 – 405 – 365 – 335 – 313 nm lines)
- Exposure modes: Constant power or constant intensisty
- Alignment modes: Front to front/ back to front (optic)
MA4 Mask Aligner
The Karl Suss MA-4 has been designed for high-accuracy photolithography in a lab environment. It can handle masks up to 5 inches in diameter, of regular or irregular shapes.
Manufacturer : Karl Suss
Model : MA-4
Masks dimensions : 3 to 5 inches
Maximal sample size : 4 inches
Contact modes: 5 differents from hard vacuum to proximity
Lamp : 350W Hg
Optics : UV 400 (436 – 405 – 365 nm lines)
Exposure : Constant power or constant intensity
Alignment : Front to Front (visible); Front to Back (infrared)
The lithography room offers two options for resist development:
Brewer Developping station
Le Brewer development station allows spray developpement of resist, substrate drying, and post bake operations.
Model: CEE 200XD
Developers avalilable in automatic mode: 3
Maximal sample size: 150 mm
Wet processing Bench
The clean wet processing bench offers many accesories for manual developping steps and drying. High purity DI water is available.
OIR 674-11 positive; 1 micron thick
AZ5214-EIR reversible resist ; used for lift off ; 1.5 microns thick
LOR5 non photosensitive; used for lift-off resist undercoat; 5 microns
KMPR 1005 negative resist, dedicated to DRIE processes, 5 microns
SU8 Resist (different thicknesses) negative resist, mainly used for microfluidic applications
AZ MiR 900
PMMA 950 A2 e-beam lithography resist