| Process name | Characteristics | Uses | Relevant equipment |
|---|---|---|---|
| S1813 |
Fine positive resin. Thickness range : 1.48 to 2.9µm. Thickness and uniformity at 4000 rpm/min : 1.54 +/- 0.01µm. Temperature of use: 115°C . Possible resolution : 0.8µm. Sample size: 5x5 mm to wafer 100 mm. |
Wet and dry etching | Mask aligner MA4, SOLVENT FUME |
| LOR 5A + S1813 |
Lift off resin. Thickness range : 450 to 950nm. Temperature of use: 150 to 190°C. Possible resolution : 1.5µm. Sample size: 5x5 mm to wafer 100 mm. |
Lift off for depositions < 950nm | Mask aligner MA4, SOLVENT FUME |
| LOR1A + S1813 |
Lift off resin. Thickness range: 100 to 200nm. Temperature of use : 150 to 190°C. Possible resolution : 1µm. Sample size : 5x5 mm to wafer 100 mm. |
Lift off for depositions < 200nm | Mask aligner MA4, SOLVENT FUME |
| AZ5214EIR |
Reversible image resin. Thickness range : 1.14 to 1.98µm. Temperature of use : ~ 120°C. Possible resolution: 1µm. Sample size: 5x5 mm to wafer 100 mm. |
Wet etching, lift off, flexible masks |
Mask aligner MA4, SOLVENT FUME |
| SPR220 7.0 |
Positive thick resin. Thickness range : 5.5 to > 50µm. Temperature of use : ~ 115°C. Possible resolution : 2.5µm. Sample size: 5x5 mm to wafer 100 mm. |
Wet etching, dry etching, litho on major topology |
Mask aligner MA4, SOLVENT FUME |
| SPR220 3.0 |
Positive resin, intermediate thickness. Thickness range : 2.5 to 4.5 µm. Temperature of use : ~ 115°C. Possible resolution: 1µm. Sample size: 5x5 mm to wafer 100 mm |
Wet etching, dry etching, litho on average topology |
Mask aligner MA4, SOLVENT FUME |
| SU8 50 |
Negative thick resin. Thickness range : 15 to 40µm. Temperature of use : ~ 95°C. Possible resolution : 10µm. Sample size: wafer 100 mm. |
PDMS moulds | Mask aligner MA4, SOLVENT FUME |
| SU8 2015 |
Negative thick resin. Thickness range : 15 to 40µm. Temperature of use : ~ 95°C. Possible resolution : 10µm. Sample size: wafer 100 mm. |
PDMS moulds | Mask aligner MA4, SOLVENT FUME |
