Process Analysis

Any process, even the most robust, can one day fail. A thorough process analysis must determine n determining the how and the why of the failure in order to apply corrective action to improve the system reliability. The likely causes range from physical failures (poor adhesion between the components, material used under the wrong conditions, etc) to contaminations at the surface of materials or in dipping baths. Analyses can determine the nature of contaminants, the physical properties of the defective material or the problem in the manufacturing process.

GCM Lab relies on the in-depth knowledge of its materials specialists to diagnose the most complex industrial challenges and to propose potential solutions. Our interdisciplinary team of chemists, engineers and physicists has a vast experience in the analysis of thin film deposition, surface treatments and the appearance of corrosion. Once the failure is identified, the GCM experts can recommend a more reliable material, a better coating or innovative ways to optimize the part design.

Analytical techniques

The choice of an analytical method relies heavily on the type of process and the material. Electronic failures are often characterized by optical microscopes or Scanning Electron Microscopes. For contamination problems, the ideal techniques are Fourier Transform Infrared Spectroscopy (FTIR), Time-of-flight Secondary Ion Mass Spectroscopy and X-Ray Photoelectron Spectroscopy (XPS).